Chip Die Bonder (High Speed Type)

Chip Die Bonder (High Speed Type)

Control No
  • AKV614A
  • Patent No4829262
  • Patent No5266507

Model No.

ASCD860T(Tray Type)
ASCD860W (Wafer Type)


This machine loads sensor chips with a high degree of accuracy, with adhesive dispensed on the sensor packages.


  • Realizes low vibration, low-particle diffusion and high speed transfer by employing a turret table.
  • Equipped with dispenser temperature control function, 0-point needle height detecting function, and dispensing position feed-back function. Also stabilizes dispensing volume and high accuracy dispensing position. Includes an option to enable package height measurement and dispensing height correction via razor displacement meter.
  • Realizes loading accuracy at ±0.015mm via newly developed image recognition method and low vibration.


Work Supply Tray Supply (piece)
Chip Supply Wafer
Cycle Time 0.6 sec/pc
Outer Dimension W1700XD1400XH1700㎜ (excludes monitor and indicating light)
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