Chip Die Bonder (High Speed Type)
- Control No
-
- AKV614A
-
- Patent No4829262
- Patent No5266507
Model No.
ASCD860T(Tray Type)
ASCD860W (Wafer Type)
Descriptions
This machine loads sensor chips with a high degree of accuracy, with adhesive dispensed on the sensor packages.
Features
- Realizes low vibration, low-particle diffusion and high speed transfer by employing a turret table.
- Equipped with dispenser temperature control function, 0-point needle height detecting function, and dispensing position feed-back function. Also stabilizes dispensing volume and high accuracy dispensing position. Includes an option to enable package height measurement and dispensing height correction via razor displacement meter.
- Realizes loading accuracy at ±0.015mm via newly developed image recognition method and low vibration.
Specification
| Work Supply | Tray Supply (piece) |
|---|---|
| Chip Supply | Wafer |
| Cycle Time | 0.6 sec/pc |
| Outer Dimension | W1700XD1400XH1700㎜ (excludes monitor and indicating light) |
-
Compact sized crystal production machines
-
Crystal oscillator and TCXO production machines
-
Tuning fork crystal production machines
-
Thermistor crystal production machines
-
Sensor device production machines
-
Semi Conductor-related machines
-
Transfer-related machines
-
Lens assembly machines
-
Camera Module-related machines