Chip Die Bonder
- Control No
- Patent No4520474
- Patent No 5574207
This machine loads sensor chips with a high degree of accuracy, with adhesive dispensed on the sensor packages.
- Realizes low vibration, low-particle diffusion and high speed transfer by employing a turret table.
- Performs bond dispensing, dispensing inspection, and loading of IC tips continuously at the same stage, Thus shortening the operation time from dispensing to loading. This is perfect for die bonding on using bond which dries easily.
- The package supply method accommodates tray (piece) and sheet substrate.
- The IC tips supply method accommodates 6" max. wafers.
|Work Supply||Tray Supply (piece), Sheet Substrate Supply|
|Cycle Time||1. 2 sec/pc|
|Outer Dimension||W1150XD1250XH1700㎜ (excludes monitor and indicating light）|