Semi Conductor-related machines

  • Die Picker

    • Accommodates max. 12"wafer ring
    • Extracts IC chips via full image positioning and performs mounting. (no mechanical centering)
    • Enables user to optionally measure the outer dimension of chips.
    • Realizes high-speed transfer by employing a turret table.
  • IC Handler

    • Supplies works to the external tester (by customer's request) and retrieves them.
    • Sets 8 pcs. to the measurement jigs simultaneously in order to achieve the inspection time.
    • Will not close magnetic substances within 300mm radius. (SUS and aluminum are treated as non-magnetic substances).
    • Performs laser marking on good quality works after completing inspection
  • Chip Mounter (Transfer Type)

    • Dispenses and load chips to the assembled substrate.
    • Achieves a high speed cycle time of 0. 35 sec. per pc. by employing a turret table.
    • Achieves a high loading position accuracy of ±0. 0015mm to accommodate micro-sized parts.
    • Loads chips on assembled substrates directly, after pasting a moderate amount of bond on the chips during turret transfer. Thus, prevents bond quality deterioration due to drying bond and improves the yield rate.