Die Picker
- Control No
-
- AKV631A
-
- Patent No4829262
- Patent No5083701
Model No.
ADIP860
Descriptions
This machine mounts IC chips picked up from wafers on the trays
Features
- Accommodates max. 12"wafer ring
- Extracts IC chips via full image positioning and performs mounting. (no mechanical centering)
- Enables user to optionally measure the outer dimension of chips.
- Realizes high-speed transfer by employing a turret table.
Specification
| Compatible Works | Chip (Wafer) |
|---|---|
| Wafer Supply | Supplies and retrieves 12" wafer ring by magazine |
| Cycle Time | 0. 3 sec. per pc. |
| Outer Dimension | W1540XD1300XH1750㎜ W1200XD1100XH1700㎜ (excludes monitor, indicating light, and chiller) |
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