Chip Mounter (Transfer Type)
- Control No
- Patent No4829262
- Patent No5076111
This machine performs die bonding for IC chips via turret transfer at high speed.
- Dispenses and load chips to the assembled substrate.
- Achieves a high speed cycle time of 0. 35 sec. per pc. by employing a turret table.
- Achieves a high loading position accuracy of ±0. 0015mm to accommodate micro-sized parts.
- Loads chips on assembled substrates directly, after pasting a moderate amount of bond on the chips during turret transfer. Thus, prevents bond quality deterioration due to drying bond and improves the yield rate.
|Compatible Works||Small Sized Electronics Component|
|Loading Position Accuracy||X, Y Direction within ±0.015㎜|
|Cycle Time||0. 35 sec. per pc.|
|Outer Dimension||W1000×D950×H1700㎜ (excludes monitor, indicating light)|