Semi Conductor-related machines

Die Picker

Control No
  • AKV631A
  • Patent No4829262
  • Patent No5083701

Model No.

ADIP860

Descriptions

This machine mounts IC chips picked up from wafers on the trays

Features

  • Accommodates max. 12"wafer ring
  • Extracts IC chips via full image positioning and performs mounting. (no mechanical centering)
  • Enables user to optionally measure the outer dimension of chips.
  • Realizes high-speed transfer by employing a turret table.

Specification

Compatible Works Chip (Wafer)
Wafer Supply Supplies and retrieves 12" wafer ring by magazine
Cycle Time 0. 3 sec. per pc.
Outer Dimension W1540XD1300XH1750㎜ W1200XD1100XH1700㎜ (excludes monitor, indicating light, and chiller)
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