- Control No
- Patent No4829262
- Patent No5083701
This machine mounts IC chips picked up from wafers on the trays
- Accommodates max. 12"wafer ring
- Extracts IC chips via full image positioning and performs mounting. (no mechanical centering)
- Enables user to optionally measure the outer dimension of chips.
- Realizes high-speed transfer by employing a turret table.
|Compatible Works||Chip (Wafer)|
|Wafer Supply||Supplies and retrieves 12" wafer ring by magazine|
|Cycle Time||0. 3 sec. per pc.|
|Outer Dimension||W1540XD1300XH1750㎜ W1200XD1100XH1700㎜ (excludes monitor, indicating light, and chiller)|