Chip Mounter (Transfer Type)
- Control No
-
- AKV633A
-
- Patent No4829262
- Patent No5076111
Model No.
ACMT860
Descriptions
This machine performs die bonding for IC chips via turret transfer at high speed.
Features
- Dispenses and load chips to the assembled substrate.
- Achieves a high speed cycle time of 0. 35 sec. per pc. by employing a turret table.
- Achieves a high loading position accuracy of ±0. 0015mm to accommodate micro-sized parts.
- Loads chips on assembled substrates directly, after pasting a moderate amount of bond on the chips during turret transfer. Thus, prevents bond quality deterioration due to drying bond and improves the yield rate.
Specification
| Compatible Works | Small Sized Electronics Component |
|---|---|
| Loading Position Accuracy | X, Y Direction within ±0.015㎜ |
| Cycle Time | 0. 35 sec. per pc. |
| Outer Dimension | W1000×D950×H1700㎜ (excludes monitor, indicating light) |
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