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Chip Die Bonder
- Realizes low vibration, low-particle diffusion and high speed transfer by employing a turret table.
- Performs bond dispensing, dispensing inspection, and loading of IC tips continuously at the same stage, Thus shortening the operation time from dispensing to loading. This is perfect for die bonding on using bond which dries easily.
- The package supply method accommodates tray (piece) and sheet substrate.
- The IC tips supply method accommodates 6" max. wafers.
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Chip Die Bonder (High Speed Type)
- Realizes low vibration, low-particle diffusion and high speed transfer by employing a turret table.
- Equipped with dispenser temperature control function, 0-point needle height detecting function, and dispensing position feed-back function. Also stabilizes dispensing volume and high accuracy dispensing position. Includes an option to enable package height measurement and dispensing height correction via razor displacement meter.
- Realizes loading accuracy at ±0.015mm via newly developed image recognition method and low vibration.
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Flip Mounter
- Realizes low vibration, low-particle diffusion and high speed transfer by employing a turret table.
- Achieves loading cycle time of 0.6 sec. per chip, by performing picking-up and loading simultaneously.
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Temp. Characteristics Adjustment Inspection Machine for TCXO
- Realizes high-throughput via the parallel processing of the temperature control buffer stage and sub PC.
- Provides a range of temperature control stages from low to high temperatures.
- Performs temperature control on the carriers transferred by the index, via Peltier temperature control plates.
- Eliminates the need for manual insertion to the socket, as an automated transfer system is available for the transfer process from trays to transfer carriers.
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Temp. Slope Inspection Machine
- High speed and high accuracy temperature slope inspection machine provides 100% total inspection.
- Performs continuous and rectilinear temperature variation inspection for the range of -35 to 85 degrees via Peltier temperature control plates. (Slope measurement ranges are for -25 to 75 degree.)
- Supplies works via designated carriers by having 80 cavities performs temperature slope inspections on the carriers.
- Accommodates small-sized ceramic packages.
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Inspection, Marking and Taping Machine
- Realizes high speed and low vibration transfer via turret transfer.
- Enables user to exchange nozzles easily by using opening and propping structures for the turret table.
- Enables user to perform highly reliable measurements, including measurements for the high frequency products, by employing secured structure at the measuring probe.
- The newly developed taping machine can be utilized to design high speed transfer and high accuracy positioning.
